Join the Orange County Chapter of the Printed Circuit Engineering Association (PCEA) for a virtual Lunch ‘n’ Learn meeting, sponsored by American Standard Circuits.

The meeting will feature two presentations: 

First presentation: Next-Gen Line/Space Capability for PCB Designs
Speakers: Anaya Vardya and John Bushie, ASC, and Haris Basit, Averatek 

The need for increasingly complex electronics, combined with the obsolescence of larger component packages, is driving innovation to provide alternatives to the traditional…

Altium’s CoDesigner capability gives PCB designers using Altium Designer (with an active subscription) a much faster and easier way to collaborate with mechanical designers

In the process of designing electronic products for industries like IoT, autonomous vehicles, and industrial automation—mechanical and electrical engineers face multiple challenges. One of the greatest sources of frustration mechanical engineers face happens when mechanical and PCB designers collaborate on the same…

Cadence Design Systems, Inc. announced the next-generation Cadence® Sigrity X signal and power integrity (SI/PI) solutions.

Sigrity X features powerful new simulation engines for system-level analysis and includes the innovative massively distributed architecture of the flagship Cadence Clarity™ 3D Solver. The new Sigrity X tool suite addresses the size and scalability challenges of system-level simulations faced by today’s leading-edge technologists in the 5G communications, automotive, hyperscale computing, and aerospace and defense industries…

PCB Design Webinar: Spend More Time Innovating by Leveraging Templates

Altium is pleased to offer free weekly webinars that cover basic and advanced challenges that designers and PCB engineers face. These webinars are short and focused live webinars that provide instruction with value and insight on the typical design and layout related topics, ranging from simple to technically complex solutions incorporating best practices. These, up to 1-hour webinars will include live instruction, Q&A, and practical demonstrations.…

IPC-2581C, Generic Requirement for Printed Board Assembly Product Manufacturing Description Data and Transfer Methodology is the eagerly anticipated update of IPC’s widely adopted global standard for PCB design through manufacturing data flow. Revision C introduces groundbreaking new features, automation supporting Industry 4.0, and bidirectional DFX intelligence capability that eliminates the time-consuming back and forth between design house and manufacturers before production can begin.

As technology in the industry progresses, including the latest additive processes with embedded components within the PCB, the IPC-2581 committee of experts has introduced support for the latest technologies, representing every aspect of modern PCB design. Updates include overhauled…